Unveiling the True Flaws of the XFX Thicke: Don't Miss Our Fix!

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Unveiling the True Flaws of the XFX Thicke: Don't Miss Our Fix!

Table of Contents

  1. Introduction
  2. Background of XFX Thicke and Coolermaster age 500 P
  3. Reviewing the Flaws of the XFX Thicke
  4. Coolermaster's Response to Criticism
  5. XFX's Second Step in Response to Criticism
  6. testing Ways to Improve the XFX Thicke
    • Removing Plastic and Back Plate
    • Adding Thermal Pads
    • Modifying the Memory Cooling Solution
    • Addressing Mounting Pressure Issues
  7. Results of the Testing
  8. Manpower Limitations in Design
  9. XFX's Responsibility for Performance Issues
  10. Recommendations for XFX to Improve Future Designs

🖥️ The XFX Thicke: A Flawed Gaming Graphics Card

Introduction

The XFX Thicke is a gaming graphics card that, like its predecessor, the Coolermaster age 500 P, started off with significant flaws. However, it remains to be seen if XFX will follow in Coolermaster's footsteps and address these issues. In the meantime, we have taken it upon ourselves to test and find ways to improve the performance of the XFX Thicke.

Background of XFX Thicke and Coolermaster age 500 P

The Coolermaster age 500 P received a lot of criticism when it was first released due to numerous flaws in its design. However, Coolermaster took this criticism seriously and made significant improvements to the case, releasing the age 500 feet mesh and the age 500 blank with mesh accompaniment, both of which received high praise.

Reviewing the Flaws of the XFX Thicke

In our review of the XFX Thicke, we highlighted several flaws that severely impacted its performance. Notably, the GPU thermals were embarrassingly high, and memory temperatures were also a cause for concern. We also identified mounting pressure as a significant issue that needed to be addressed.

Coolermaster's Response to Criticism

Coolermaster's response to the criticism of the age 500 P serves as a great example of how a company should handle feedback. They listened to the concerns of consumers and completely overhauled their approach to cases, resulting in improved designs that garnered strong recommendations.

XFX's Second Step in Response to Criticism

While we wait to see how XFX will respond to our scathing review of the Thicke, we have taken it upon ourselves to explore ways to improve the card's performance. Our goal is to illustrate the potential improvements that could have been implemented by XFX if they had approached the design more carefully and thoroughly tested their products.

Testing Ways to Improve the XFX Thicke

We conducted various tests to identify ways to enhance the performance of the XFX Thicke. One of the first steps we took was to remove the plastic embellishments and the backplate, which had a significant impact on both memory and GPU thermals. This simple modification led to noticeable improvements in the card's overall performance.

Adding thermal pads to the memory cooling solution was another approach we took to further improve thermals. While we faced limitations due to the excessive gap between the backplate and the PCB, we still managed to achieve some degree of improvement. However, we believe that XFX should consider reducing this gap and implementing thermal pads to optimize heat transfer.

Addressing mounting pressure was another crucial aspect we explored during our testing. Manpower limitations in the design process can sometimes result in inadequate mounting pressure, leading to subpar performance. XFX needs to address this issue and ensure proper mounting pressure to avoid potential thermal issues.

Results of the Testing

Our testing yielded promising results. By removing the plastic embellishments, including the top plastic piece and the grill, we observed a significant reduction in GPU and memory temperatures. Additionally, removing the backplate further improved thermals, although not as significantly as the plastic removal.

Manpower Limitations in Design

One of the key challenges faced by manufacturers, including XFX, is the limitation of manpower in the design process. As Recruiting factory workers becomes increasingly difficult in Shenzhen, it directly affects the design decisions and ability to implement certain modifications. Addressing mounting pressure and ensuring proper paste application require additional oversight and resources.

XFX's Responsibility for Performance Issues

While manpower limitations can Present challenges, it is essential to acknowledge that XFX bears some responsibility for the performance issues of the Thicke. The excessive plastic embellishments and the lack of a functional backplate had a detrimental impact on the card's overall performance. XFX should prioritize design improvements that focus on removing unnecessary elements and ensuring effective heat dissipation.

Recommendations for XFX to Improve Future Designs

Based on our testing and analysis, we recommend several improvements that XFX should consider for future designs. First and foremost, reducing the gap between the backplate and the PCB would enhance thermal performance. Implementing thermal pads between the components and the backplate, especially for memory cooling, would further optimize heat transfer. Lastly, XFX should improve the oversight and quality control processes to ensure adequate mounting pressure and proper paste application.

In conclusion, the flaws of the XFX Thicke demonstrate the importance of responding to criticism and implementing necessary improvements. While there are limitations in the design process, XFX should take responsibility for the performance issues and strive to create gaming graphics cards that meet the expectations of consumers. By addressing mounting pressure, removing excessive plastic embellishments, and optimizing heat dissipation, XFX has the potential to deliver outstanding, high-performance graphics cards.

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