Unleashing the Power: Intel's 14nm Process Technology Explained
Table of Contents
- Introduction
- Intel's 22 Nanometer Technology
- Intel's Scaling Trend
- A Closer Look at 14 Nanometer Technology
- Intel's Second Generation Tri-Gate Transistors
- Interconnects in Logic Technology
- Memory Cells in 14 Nanometer Technology
- Intel's Logic Area Scaling
- Cost and Performance Benefits
- Intel Core M Processor
- SOC and Feature Menu
- Conclusion
Introduction
Intel is at the forefront of developing advanced logic technologies, and their 14 nanometer generation is a significant milestone in their ongoing scaling trend. This article explores Intel's 14 nanometer technology in depth, covering topics such as transistor scaling, interconnects, memory cells, cost per transistor, performance benefits, and the Intel Core M processor. With a comprehensive menu of features and options, Intel's 14 nanometer technology is poised to deliver high-performance and energy-efficient solutions across various market segments.
Intel's 22 Nanometer Technology
High Volume Manufacturing
Intel's 22 nanometer technology, with its 3D trigate or finfet transistors, has been in high volume manufacturing for a couple of years. Over 500 million chips have already been shipped using this technology, marking a significant success for Intel's first-generation trigate transistors.
Benefits of Smaller Transistors
The ongoing trend of developing new generations of technology with smaller transistors Stems from several advantages they offer. Smaller transistors provide higher performance, lower power consumption, and lower cost per transistor. This aligns with Moore's Law and Intel's continuous drive towards improving device performance and efficiency.
Intel's Scaling Trend
Intel has a rich history of scaling its technology over the past 40 years. Each new generation features a scaling factor of approximately 0.7x, reducing the feature size to achieve smaller transistors. This scaling trend is driven by the pursuit of improved performance, power efficiency, and cost-effectiveness.
Transistor Feature Size
To understand the Scale of Intel's 14 nanometer technology, it's essential to explore dimensional scales. The 14 nanometer technology resides in the nanometer regime, where Dimensions range from the visible real world to the incredibly tiny. The critical dimension of the 14 nanometer process is the width of the silicon fin in the trigate transistor, which measures about eight nanometers.
Moore's Law Definition
Moore's Law, as embraced by Intel, is the scaling trend that seeks to reduce feature sizes by approximately 0.7x per generation. This scaling enables the development of smaller and more efficient transistors, resulting in improved performance, lower power consumption, and reduced cost per transistor. Intel's 14 nanometer technology embodies the principles of Moore's Law.
A Closer Look at 14 Nanometer Technology
The 14 nanometer technology developed by Intel offers significant advancements in manufacturing processes, resulting in higher performance and energy-efficient devices.
Defining Nanometer Dimensions
The nanometer scale is incredibly small, ranging from dimensions in meters down to the nanometer regime. To provide context, some examples of nanometer-scale dimensions include the Height of a housefly, the diameter of a human red blood cell, and the spacing between silicon atoms in a crystal. The 14 nanometer technology operates in the realm of the smallest attainable dimensions, pushing the boundaries of what we can perceive.
Silicon Fins in Tri-Gate Transistors
A fundamental component of Intel's 14 nanometer technology is the silicon fin used in trigate transistors. These fins, with a width of eight nanometers, play a crucial role in the construction of the transistor. The tight tolerances and smaller dimensions result in improved transistor performance, particularly at lower voltages.
Close-Up View of 14 Nanometer Transistors
Examining a pair of silicon fins used in a 14 nanometer trigate transistor provides insight into the intricate structure of these devices. The fins are surrounded by an insulating layer and a high-k layer, with the gate electrode situated on top. The 14 nanometer technology achieves significant density improvements by tightly packing these silicon fins, which measure only eight nanometers in width.
Intel's Second Generation Tri-Gate Transistors
Building upon their previous trigate transistor technology, Intel introduces their Second-generation 14 nanometer trigate transistors, which offer further advancements in performance and density.
Scaling the Fins
In the second generation of 14 nanometer technology, Intel achieves finer scale by scaling down the Pin pitch and making the fins both taller and thinner. This combination of tighter pin pitch, thinner fins, and taller structures contributes to improved transistor performance, especially at lower voltage levels. Furthermore, depopulating some fins allows for even higher density and reduced capacitance, resulting in increased performance and lower power consumption.
Improvements in Density
Intel's 14 nanometer technology is characterized by its remarkable density improvements. The combination of scaled fins, finer pitch, and optimized transistor designs results in higher transistor count within a given chip area. The first product on this generation, the Intel Core M processor, exemplifies this density improvement with its 1.9 billion transistors packed into an 82 square millimeter chip.
Interconnects in Logic Technology
While transistors play a significant role in technology advancements, interconnects are equally critical for achieving high-density and high-performance logic devices.
Importance of Interconnects
Interconnects serve as the intricate network that links transistors together to form functional circuits. In logic technology, interconnects are classified into different layers, with the lower layers focusing on tight pitch for maximum density and the upper layers emphasizing thickness and coarser pitch for enhanced performance. Achieving an optimal balance between density and performance is crucial for overall chip performance and power efficiency.
Interconnect Stack
Intel's 14 nanometer technology offers a range of interconnect stack options, allowing customization to meet specific requirements. By selecting the number of layers and choosing between fine pitch, coarse pitch, or a combination, designers can tailor the interconnect stack to optimize density, performance, or balance between the two. This flexibility enables Intel to deliver technology solutions that cater to a wide range of applications and market segments.
Memory Cells in 14 Nanometer Technology
Memory cells play a vital role in logic devices, and Intel's 14 nanometer technology incorporates significant advancements in memory cell design.
Shrinking Memory Cell Sizes
Intel's 14 nanometer technology achieves remarkable area scaling in memory cells compared to previous generations. By reducing the dimensions of memory cells, Intel can pack more cells into a smaller area, leading to improved memory density. This scaling trend aligns with Moore's Law, as smaller memory cell sizes enable greater transistor counts and more extensive functionality within a given chip area.
Area Scaling in Memory Cells
The area scaling trend in memory cells is a key consideration in technology development. Intel's 14 nanometer technology achieves an area scaling factor of approximately 0.54x compared to the previous generation. This significant improvement in area scaling further enhances the overall density, performance, and power efficiency of memory cells.
Intel's Logic Area Scaling
The scaling of gate pitch and metal pitch is a critical aspect of technology advancements, impacting overall density and cost per transistor.
Gate Pitch Scaling
Gate pitch scaling, which refers to the distance between transistor gates, plays a crucial role in achieving excellent density and performance characteristics. Intel's gate pitch scaling trend has been approximately 0.8x per generation, striking the right balance between performance, density, and leakage control. This scaling trend reflects the careful optimization and continuous improvement efforts employed by Intel's engineers and researchers.
Metal Pitch Scaling
Metal pitch scaling, another critical parameter, affects the density and performance of interconnects within a logic device. Intel's metal pitch scaling trend has achieved a scaling factor of approximately 0.65x on their 14 nanometer technology. This improved scaling trend contributes to better than normal area scaling and higher overall chip density, facilitating greater functionality within a given chip area.
Comparison to Other Companies
When comparing Intel's logic area scaling with other companies in the industry, it becomes apparent that Intel has consistently been at the forefront of technology development. While some companies may boast slightly better density due to tighter gate pitches, Intel's early introduction of technologies ensures they remain competitive in terms of overall scaling. The solid red data point in the graph represents Intel's technology, with other companies following suit and achieving similar scaling trends later in time.
Cost and Performance Benefits
Scaling technology not only improves performance and density but also contributes to cost per transistor reduction, benefiting both Intel and end consumers.
Cost per Transistor
Cost per transistor is a fundamental aspect of Moore's Law and Intel's technology advancements. Intel's ongoing efforts to shrink feature sizes aim to achieve lower costs per transistor. While wafer costs may increase due to additional manufacturing steps, the improved area scaling and reduced transistor sizes offset these costs. Intel's 14 nanometer technology maintains a consistently lower cost per transistor even in the face of increased wafer costs.
Performance and Leakage
One of the primary benefits of smaller transistors is the improved performance and reduced leakage. Intel's 14 nanometer technology, with its second-generation trigate transistors, provides enhanced global performance and leakage control. This results in faster and more efficient transistors overall. Furthermore, Intel's extensive design process co-optimization between the process development and design teams ensures that each product delivers the best possible performance, power efficiency, and cost per transistor.
Performance per Watt
Performance per watt is a key consideration for modern processors. Intel's 14 nanometer technology consistently delivers improved performance per watt with each generation. The Intel Core M processor, in particular, achieves over 2x performance per watt improvement compared to previous generations. The combination of process technology advancements, microarchitecture optimizations, and careful design considerations contributes to this exceptional performance boost, enabling high-performance computing with reduced power consumption.
Intel Core M Processor
The Intel Core M processor stands as a testament to the capabilities of Intel's 14 nanometer technology. With its remarkable performance, power efficiency, and innovative features, the Core M processor sets a new standard in mobile computing.
Improved Performance and Power Efficiency
The Intel Core M processor offers up to 50% faster CPU performance and significantly improved graphics performance compared to the previous generation. Despite these performance gains, the Core M processor consumes only 4.5 watts of power, enabling longer battery life and fanless designs. The reduction in thermal design point by 60% further enhances the efficiency and power-saving capabilities of the processor. Additionally, the Core M processor is conflict-free, ensuring the responsible sourcing of materials.
Features and Benefits
The Intel Core M processor harnesses the full potential of Intel's 14 nanometer technology to deliver an exceptional computing experience. Its dense chip area scaling enables higher transistor counts, resulting in improved performance and multitasking capabilities. The Core M processor also incorporates advanced microarchitecture optimizations, minimizing power consumption while maximizing performance. With fanless designs and reduced thermal requirements, the Core M processor offers a versatile solution for mobile laptops, two-in-ones, and other portable devices.
SOC and Feature Menu
Intel's advanced SOC (System-on-Chip) technology incorporates a diverse range of features and options, enabling customization and adaptability for specific applications and market needs.
SOC Superset
Previously, Intel developed separate versions of their technology for CPU and SOC applications. However, these versions have now converged into a customizable SOC menu that offers a broad spectrum of performance and power options. SOC technology serves as a superset, encompassing additional features and variants to accommodate a range of requirements, from high-performance computing to ultra-low power applications.
Variety of Transistor Options
The SOC feature menu includes various transistor options to cater to different performance and power requirements. Intel offers high-performance, general-performance, and low-power transistor families, each with its unique characteristics. This diverse range of transistor options allows designers to select the best-suited transistors for their specific application needs, achieving the desired balance between performance and power efficiency.
Customization of Interconnect Stacks
Interconnects play a crucial role in SOC technology, and Intel's menu of features extends to the choice of interconnect stacks. By customizing the mix of interconnect layers, designers can optimize density, performance, or strike a balance between the two. Whether a design requires finer pitch layers for high density or coarser pitch layers for improved performance, Intel's flexible interconnect stacks accommodate a broad spectrum of design needs.
Additional Features in SOC
In addition to the transistors and interconnect options, Intel SOC technology incorporates other essential features to enhance functionality and address specific application requirements. These features include inductors, high-density memcaps, precision resistors, RF transistors, very low leakage analog transistors, and high-voltage IO transistors. The SOC feature menu ensures that designers have the necessary building blocks to create tailored solutions for a wide range of applications.
Conclusion
Intel's 14 nanometer technology represents a significant milestone in technology scaling. With improved performance, power efficiency, and cost per transistor, Intel continues to push the boundaries of technology advancement. By offering a comprehensive menu of features and options, Intel enables designers to create high-performance and energy-efficient solutions tailored to specific application needs. The Intel Core M processor, built on the foundation of 14 nanometer technology, embodies the best-in-class performance and power efficiency demanded by today's mobile computing market.
Highlights
- Intel's 14 nanometer technology marks a significant milestone in their scaling trend.
- Smaller transistors provide higher performance, lower power consumption, and lower cost per transistor.
- Intel's scaling trend aims for approximately 0.7x reduction in feature size per generation.
- The critical dimension of the 14 nanometer technology is the width of the silicon fin in the trigate transistor.
- Intel's second-generation trigate transistors offer improved performance and density.
- Interconnects play a crucial role in achieving high-density and high-performance logic devices.
- Intel's 14 nanometer technology achieves remarkable area scaling in memory cells.
- Intel's logic area scaling focuses on gate pitch and metal pitch scaling for improved density.
- Intel's 14 nanometer technology delivers improved performance per watt.
- The Intel Core M processor showcases the capabilities of Intel's 14 nanometer technology.
- Intel's SOC technology offers a customizable menu of features and options to meet different application needs.
FAQ
Q: How does Intel's 14 nanometer technology compare to previous generations?
A: Intel's 14 nanometer technology offers improved performance, power efficiency, and density compared to previous generations. With its second-generation trigate transistors and advanced interconnects, the 14 nanometer technology delivers significant advancements in transistor scaling and overall chip density.
Q: What are the benefits of smaller transistors?
A: Smaller transistors provide higher performance, lower power consumption, and lower cost per transistor. This allows for faster and more energy-efficient devices while reducing manufacturing costs.
Q: How does Intel's technology achieve improved performance per watt?
A: Intel's 14 nanometer technology, combined with microarchitecture optimizations, provides better performance per watt compared to previous generations. The Intel Core M processor, built on this technology, showcases over 2x improvement in performance for watt ratio, enabling longer battery life and fanless designs.
Q: Can Intel's 14 nanometer technology be customized for different applications?
A: Yes, Intel's SOC feature menu offers a wide range of customization options for different application requirements. Designers can choose from various transistor options, interconnect stacks, and additional features to tailor their designs to specific needs, whether it's high performance, low power, or specific functionalities.
Q: How does Intel's 14 nanometer technology contribute to cost reduction?
A: Intel's ongoing efforts to shrink feature sizes and improve area scaling result in lower costs per transistor. Although wafer costs may increase due to additional manufacturing steps, the overall cost per transistor still reduces with each generation, making Intel's technology more cost-effective.
Q: What are the key highlights of Intel's 14 nanometer technology?
A: Intel's 14 nanometer technology offers improved performance, power efficiency, and cost per transistor. It achieves remarkable density improvements, provides a wide range of customization options, and enables the development of high-performance processors like the Intel Core M processor. By embracing advanced transistor scaling and interconnect technologies, Intel stays at the forefront of innovation in the semiconductor industry.
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