Intel and UMC Join Forces for Revolutionary Foundry Collaboration

Table of Contents

1. Introduction
2. Intel and UMC Collaboration
3. 12 Nanometer Semiconductor Process Platform
4. High Growth Markets
5. Greater Choice for Global Customers
6. Importance of Taiwan in the Semiconductor Ecosystem
7. Intel's Commitment to Collaboration
8. UMC's Strategy and Customer Commitment
9. Benefits of the Collaboration
10. Production and Technology Development
11. Customer Demand and Design Enablement
12. Intel's Global Investments and Manufacturing Sites
13. UMC's History and Expertise
14. Conclusion

🌟 Intel and UMC Announce New Foundry Collaboration

In a groundbreaking announcement, Intel Corporation and United Micro Electronics Corporation (UMC) have joined forces to collaborate on the development of a 12 nanometer (nm) semiconductor process platform. This collaboration aims to address high growth markets such as mobile communication infrastructure and networking. The long-term agreement between the two companies will bring together Intel's manufacturing capacity and UMC's extensive foundry experience, enabling an expanded process portfolio and providing customers with a more geographically diversified and resilient supply chain.

1. Introduction

The semiconductor industry plays a vital role in today's rapidly advancing technological landscape. As demand for innovative solutions in mobile communication infrastructure and networking continues to rise, Intel and UMC have recognized the need to join forces to meet these challenges head-on. By collaborating on the development of a 12nm semiconductor process platform, Intel and UMC aim to leverage their combined strengths to provide customers with cutting-edge technology and manufacturing capabilities.

2. Intel and UMC Collaboration

The collaboration between Intel and UMC is a strategic partnership that brings together two industry leaders in semiconductor technology. With Intel's extensive manufacturing capacity and UMC's proven foundry experience, the partnership is well-positioned to offer customers a wider range of solutions and a more resilient supply chain. By combining their resources and expertise, Intel and UMC are paving the way for technological advancements and innovation in the semiconductor industry.

3. 12 Nanometer Semiconductor Process Platform

At the heart of this collaboration is the development of a 12nm semiconductor process platform. This advanced process technology will enable the production of high-performance integrated circuits with improved power efficiency and performance. By leveraging Intel's US-based high-volume manufacturing capacity and UMC's decades of process leadership, the 12nm node offers a strong combination of maturity, performance, and power efficiency.

4. High Growth Markets

The collaboration between Intel and UMC specifically targets high growth markets, such as mobile communication infrastructure and networking. These markets require cutting-edge semiconductor solutions to meet the increasing demand for faster, more reliable, and efficient communication systems. By focusing on these markets, Intel and UMC aim to provide customers with the necessary technology and manufacturing capabilities to drive innovation and drive growth in these sectors.

5. Greater Choice for Global Customers

One of the key benefits of this collaboration is the expanded sourcing options it offers to global customers. By combining Intel's manufacturing capacity and UMC's foundry services, customers now have access to a more geographically diversified and resilient supply chain. This enables them to make more informed sourcing decisions and ensures a reliable and efficient supply of semiconductors for their products.

6. Importance of Taiwan in the Semiconductor Ecosystem

Taiwan has long been a critical part of the Asian and global semiconductor and border technology ecosystem. It has a rich history of technological innovation and expertise in the semiconductor industry. By collaborating with innovative companies in Taiwan like UMC, Intel is strengthening its commitment to serving global mobile customers and further cementing Taiwan's importance in the global semiconductor landscape.

7. Intel's Commitment to Collaboration

As a global leader in semiconductor technology, Intel is committed to collaborating with other industry players to drive technological advancements and innovation. By partnering with UMC, Intel aims to leverage their complementary strengths to deliver technology and manufacturing innovation across the global semiconductor supply chain. This collaboration represents an important step toward Intel's goal of becoming the world's Second-largest foundry by 2030.

8. UMC's Strategy and Customer Commitment

UMC, with its more than 40-year history in the semiconductor industry, has established itself as a preferred supplier of foundry services to critical applications. The collaboration with Intel on a US-manufactured 12nm process with FinFET capabilities aligns with UMC's strategy of pursuing cost-efficient capacity expansion and technology node advancement. This partnership allows UMC to broaden its addressable market and accelerate its development roadmap, benefiting both the company and its customers.

9. Benefits of the Collaboration

The collaboration between Intel and UMC offers several benefits for both companies and their customers. By leveraging Intel's manufacturing capacity, UMC can smoothly migrate its customers to the 12nm process node while capitalizing on the resiliency provided by an additional Western footprint. The combination of Intel's high-volume manufacturing capacity and UMC's process leadership and design assistance enables the production of high-quality integrated circuits with exceptional performance, power efficiency, and yields.

10. Production and Technology Development

The production of the 12nm process will take place in Fabs 12, 22, and 32 at Intel's Arizona fabrication site, utilizing existing equipment to optimize utilization and reduce upfront investment requirements. The two companies will work together to satisfy customer demand and cooperate on design enablement, ensuring the 12nm process is well-supported by electronic design automation and intellectual property solutions from ecosystem partners. The production of the 12nm process is expected to begin in 2027.

11. Customer Demand and Design Enablement

Through their collaboration, Intel and UMC are focused on meeting the evolving needs of their customers. By pooling their resources and expertise, the two companies aim to address customer demand for advanced semiconductor solutions in high growth markets. This collaboration also ensures that customers have access to the necessary design enablement tools and support required for successful implementation of the 12nm process.

12. Intel's Global Investments and Manufacturing Sites

Intel has been at the forefront of investing and innovating in the semiconductor industry for over 55 years. With established manufacturing sites and investments in various locations around the world, including the US, Europe, and Asia, Intel is well-positioned to deliver cutting-edge technology and manufacturing capabilities to its global customer base. This extensive global footprint is a testament to Intel's commitment to driving technological advancement and innovation.

13. UMC's History and Expertise

UMC has a rich history of being a preferred supplier of foundry services to critical applications across a wide range of industries, including automotive, industrial, display, and communications. With over 40 years of experience, UMC has demonstrated expertise in providing customers with process design kits (PDK) and design assistance, ensuring high yields and industry-leading foundry utilization. This collaboration with Intel further showcases UMC's commitment to its customers and its continued leadership in innovation.

14. Conclusion

The collaboration between Intel and UMC is a significant step forward in the semiconductor industry. By joining forces and leveraging each other's strengths, both companies are well-equipped to address the growing demand for advanced semiconductor solutions in high growth markets. This collaboration not only expands the choice for global customers but also fosters technological advancement and innovation. With their combined expertise, Intel and UMC are poised to Shape the future of the semiconductor industry.

Highlights

• Intel and UMC announce collaboration on a 12nm semiconductor process platform.
• The collaboration aims to address high growth markets such as mobile communication infrastructure and networking.
• Intel's manufacturing capacity and UMC's foundry experience provide customers with a more geographically diversified and resilient supply chain.
• The 12nm process enables high-performance integrated circuits with improved power efficiency and performance.
• Taiwan plays a crucial role in the global semiconductor ecosystem, and this collaboration strengthens Intel's commitment to the region.
• The collaboration accelerates UMC's development roadmap and broadens its addressable market.
• Customers benefit from the combination of Intel's manufacturing capacity and UMC's process leadership, design assistance, and high yields.
• The production of the 12nm process is expected to begin in 2027, utilizing Intel's existing fabrication sites in Arizona.
• Intel's global investments and UMC's expertise position both companies as leaders in the semiconductor industry.
• The collaboration fosters technological advancement and innovation in the semiconductor industry.

FAQ

Q: What is the purpose of the collaboration between Intel and UMC? A: The collaboration aims to develop a 12nm semiconductor process platform to address high growth markets such as mobile communication infrastructure and networking.

Q: How will customers benefit from this collaboration? A: Customers will have access to a more geographically diversified and resilient supply chain, with high-quality integrated circuits that offer improved power efficiency and performance.

Q: Where will the production of the 12nm process take place? A: The production will take place in Fabs 12, 22, and 32 at Intel's Arizona fabrication site, leveraging existing equipment and reducing upfront investment requirements.

Q: When is the production of the 12nm process expected to begin? A: The production is expected to begin in 2027.

Q: What is the significance of Taiwan in the collaboration between Intel and UMC? A: Taiwan has been a critical part of the Asian and global semiconductor ecosystem, and this collaboration further strengthens Intel's commitment to collaborating with innovative companies in Taiwan.

Resources

• Intel Corporation
• United Micro Electronics Corporation