Accelerating Innovation: Chiplets and the Advanced Interface Bus

Accelerating Innovation: Chiplets and the Advanced Interface Bus

Table of Contents:

1. Introduction
2. The Concept of Chicklets
3. Advantages of Chicklets in Device Construction
4. The Role of Advanced Interface Bus (AIB)
5. OTSA Subgroup's Report on Protocol Link Layer
6. Quoting Gordon Moore and the Challenges of Moore's Law
7. Heterogeneous Integration and Mixing Processes
8. The Advantages of Advanced Packaging Technologies
9. The Design Style and Considerations for Wiring Density
10. The Economics Behind Chiplets and Development Costs

Introduction

In this article, we will explore the concept of chicklets and how they contribute to extending Moore's Law. We will discuss the advanced interface bus (AIB) and its role in device construction. We will also provide a report on the protocol link layer workgroup's progress in the OTSA subgroup. Additionally, we will delve into the challenges of quoting Gordon Moore and the implications of heterogeneous integration. The advantages of advanced packaging technologies and the considerations for wiring density will also be covered. Finally, we will explore the economics behind chiplets and development costs.

🔍 The Concept of Chicklets

Chicklets refer to the idea of building large systems out of smaller, individually packaged components that are interconnected. This concept was Mentioned by Gordon Moore, who proposed the doubling of transistors in a given area every year. Chicklets allow for the optimization of different functions and processes by combining them in a multi-chip package. This approach is particularly popular in the US government space, where large quantities of devices need to be built cost-effectively.

Advantages of Chicklets in Device Construction

The use of chicklets offers various advantages in device construction. One advantage is heterogeneous integration, which allows for the mixing of different processes and functions within a single Package. This enables the combination of analog and digital components optimized for specific purposes. Another advantage is the ability to reuse existing components from a library, which can significantly reduce the complexity and development time of complex systems. Furthermore, advancements in packaging technologies, such as the silicon interposer, have opened up new design possibilities and improved cost-effectiveness.

💡 The Role of Advanced Interface Bus (AIB)

The Advanced Interface Bus (AIB) serves as a clock for Parallel data transfer in advanced packaging technologies. It provides a standardized interface for interconnecting chiplets within a multi-chip package. The AIB is particularly well-suited for use with advanced packaging technologies like Intel's email and TSMC's silicon interposer. It enables high-density interconnectivity between chiplets and allows for a different design style than traditional organic substrate packages. AIB-based chiplet ecosystems have already been adopted by several companies, including Intel and Silicon.

📊 OTSA Subgroup's Report on Protocol Link Layer

The OTSA subgroup has been working on developing protocols for the protocol link layer in chiplet ecosystems. This layer plays a crucial role in facilitating communication between chiplets within a multi-chip package. The subgroup is focused on ensuring the compatibility and interoperability of different chiplets through the use of standardized protocols. Several protocols, such as CXL, OpenCAPI, and actually streaming, are being evaluated based on their functional requirements, performance, and implementation complexity.

🌐 Quoting Gordon Moore and the Challenges of Moore's Law

Quoting Gordon Moore has become a common practice when discussing advancements in semiconductor technology. However, Moore's Law poses unique challenges due to its rapid evolution. While Moore's Law predicts the doubling of transistors in a given area every year, it also anticipates the potential need for building large systems out of smaller, interconnected components. This concept, known as chicklets, addresses the challenges of scaling monolithic devices and offers alternative solutions for maintaining competitiveness.

🔌 Heterogeneous Integration and Mixing Processes

Heterogeneous integration plays a vital role in the construction of chiplet-based devices. It allows for the mixing of different processes and functions, resulting in optimized systems. For example, an analog-to-digital converter (ADC) can be combined with a digital logic process like a CPU or FPGA. This approach enables the use of specialized processes for specific functions while maintaining compatibility and performance. Heterogeneous integration has gained importance as complex systems become more challenging and time-consuming to develop.

📦 The Advantages of Advanced Packaging Technologies

Advanced packaging technologies, such as silicon interposers and fan-out technologies, offer significant advantages over traditional organic substrate packages. These technologies allow for higher wiring density, enabling a more efficient design style. For example, Intel's email technology provides up to 8 times the I/O density compared to standard flip-chip packaging. This increased density allows for more parallel connections and optimized interconnectivity within multi-chip packages.

🔌 The Design Style and Considerations for Wiring Density

In designing chiplet-based devices, wiring density plays a crucial role. The availability of a large number of wires per millimeter enables a more parallel design approach. However, it is essential to balance wiring density with the specific requirements of each chiplet. While higher wire density may seem advantageous, it can lead to increased latency and serialization costs. Therefore, the design style should consider the specific needs of each chiplet and strike a balance between wiring density and efficient performance.

💰 The Economics Behind Chiplets and Development Costs

The use of chiplets offers economic advantages, particularly in high-volume production scenarios. Building monolithic devices for large-Scale production can be challenging and expensive. Chiplets, on the other HAND, provide the flexibility to select and combine components from a library, reducing development costs and improving competitiveness. The economics of chiplets are further driven by the availability of open source and royalty-free protocols, such as the Advanced Interface Bus (AIB), which enable broader adoption and reduce upfront development costs.

Highlights:

• Chicklets enable the construction of large systems from smaller, interconnected components.
• Heterogeneous integration allows for the mixing of different processes and functions.
• Advanced packaging technologies offer increased wiring density and improved design flexibility.
• The Advanced Interface Bus (AIB) serves as a clock for parallel data transfer in chiplet ecosystems.
• The OTSA subgroup is working on developing protocols to facilitate communication between chiplets.
• Quoting Gordon Moore poses challenges but provides insights into alternative approaches.
• Considerations of wiring density and efficient design styles are crucial in chiplet-based devices.
• Chiplets offer economic advantages by reducing development costs and improving competitiveness.
• Open source and royalty-free protocols, like AIB, promote broader chiplet adoption.

❓ FAQ:

Q: What are the advantages of using chiplets in device construction? A: Chiplets offer the benefits of heterogeneous integration, reuse of components, and advanced packaging technologies, resulting in optimized systems, reduced complexity, and improved cost-effectiveness.

Q: How does the Advanced Interface Bus (AIB) contribute to chiplet ecosystems? A: AIB serves as a clock for parallel data transfer in advanced packaging technologies, enabling high-density interconnectivity between chiplets within a multi-chip package.

Q: What protocols are being evaluated for the protocol link layer in chiplet ecosystems? A: Several protocols, including CXL, OpenCAPI, and actually streaming, are being evaluated based on their functional requirements, performance, and implementation complexity.

Q: What challenges does Moore's Law pose, and how do chiplets address them? A: Moore's Law predicts the doubling of transistors in a given area every year but also recognizes the need for building large systems out of smaller, interconnected components. Chiplets, or chicklets, offer alternative solutions for scaling and maintaining competitiveness.

Q: What are the economic benefits of using chiplets? A: Chiplets provide cost advantages by reducing development costs, offering component reuse, and enabling competitiveness through optimized systems and broad adoption of open source and royalty-free protocols like AIB.

Resources:

• Intel Advanced Interface Bus (AIB) Specification
• Dyna Tie Protocol Working Group